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Chapter 5
Table 5.2 Summary of deposition parameters in the lift-off experiment.
Deposition parameters Mo25/2 Mo25/15
Both
Technique DC sputtering DC sputtering
Temperature Room temperature Room temperature
Target distance (mm) 55 55
Bottom layer
Argon pressure (mTorr) 25 25
Argon flow (sccm) 200 200
Current (A) 1.5 1.5
Power (kW) 0.4 0.4
Power density (W/cm ) 2 1.2 1.2
Deposition time (min) 14.5 14.5
Thickness (μm) 0.1 0.1
Top layer
Argon pressure (mTorr) 2 15
Argon flow (sccm) 11 110
Current (A) 3 3.55
Power (kW) 1.0 1.0
Power density (W/cm ) 2 3.1 3.1
Deposition time (min) 23.3 22.7
Thickness (μm) 0.9 0.6
Full film
Sheet resistance ( Ω/☐) 0.27 1.54
Thickness (μm) 1.0 0.7
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Table 5.2 Summary of deposition parameters in the lift-off experiment.
Deposition parameters Mo25/2 Mo25/15
Both
Technique DC sputtering DC sputtering
Temperature Room temperature Room temperature
Target distance (mm) 55 55
Bottom layer
Argon pressure (mTorr) 25 25
Argon flow (sccm) 200 200
Current (A) 1.5 1.5
Power (kW) 0.4 0.4
Power density (W/cm ) 2 1.2 1.2
Deposition time (min) 14.5 14.5
Thickness (μm) 0.1 0.1
Top layer
Argon pressure (mTorr) 2 15
Argon flow (sccm) 11 110
Current (A) 3 3.55
Power (kW) 1.0 1.0
Power density (W/cm ) 2 3.1 3.1
Deposition time (min) 23.3 22.7
Thickness (μm) 0.9 0.6
Full film
Sheet resistance ( Ω/☐) 0.27 1.54
Thickness (μm) 1.0 0.7
130
